TEGO WET 500

TEGO WET 500 is a silicone-free substrate wetting additive that provides excellent substrate wetting and anti-crater effect. It promotes flow and has low foam properties. TEGO WET 500 is universally applicable and suitable for waterborne, solventborne and radiation-curing formulations. As a non-ionic organic surfactant, TEGO WET 500 reduces dynamic surface tension for better substrate wet-out and film leveling. Its low foam properties make it suitable for high-speed application lines. TEGO WET 500 delivers benefits such as reduced pinholes, enhanced gloss and smoothness in coating applications.